Western Digital UFS 3.1 enables the storage of new applications in the mobile, automotive and IoT sectors

Western Digital announced its new integrated flash platform for Universal Flash Storage (UFS) 3.1 to enable new applications in mobile, automotive, IoT, AR / VR, drones and other segments emerging that are reshaping the way we live, work and play.

In an increasingly mobile world, always on, always connected and always available, Western Digital’s unique UFS 3.1 platform, based on the JEDEC-compliant UFS 3.1 specification, delivers the speed, reliability and versatility of features on which customers light solutions.

Leveraging its vertical integration capability to optimize NAND, firmware, controller design, software and drivers, Western Digital can efficiently design solutions specifically designed for a variety of markets including mobile, IoT , automotive, etc., all while taking advantage of a common UFS 3.1 architecture. Setting a new benchmark, this new platform is expected to offer up to 90% improvement in sequential write performance, compared to its previous generation.

This improvement will help realize the potential of 5G download speed and Wi-Fi 6, providing a better experience when consuming rich media files such as 8K video, as well as improved performance for applications such as mode photography. gust.

“We are only scratching the surface today on the services, technologies and devices that will be built around mobility, but one thing is clear, flash storage is at the heart of their success,” said Huibert Verhoeven, vice-president. senior president of automotive, mobile and emerging markets. Flash Business, Western Digital. “With our new UFS 3.1 platform, we are opening up new opportunities that could never have existed before, and we are excited to continue working with our customers to help them design, differentiate and add value to their solutions. . “

Western Digital has developed products based on this platform, starting with its new family for mobile and consumer applications, and is working with its hardware ecosystem partners to enable it on their future solutions. The company plans to deliver its products to market in 2H2021.


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